ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,793, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Resistance temperature detector at hybrid bond... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,794, issued on Nov. 3, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Front-end module with vertically stacked die and circulator" was i... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,795, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Modular package structures with interposers ha... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,796, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Package-on-package (POP) type semiconductor pa... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,797, issued on Nov. 3, was assigned to MOSAIC MICROSYSTEMS LLC (Rochester, N.Y.). "Facilitating formation of a via in a substrate" was inven... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,798, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor package" w... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,799, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and manufacturing method therefor" wa... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,800, issued on Nov. 3, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device with different side surfaces thickness for a plur... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,801, issued on Nov. 3, was assigned to Mitsui High-tec Inc. (Fukuoka, Japan). "Metal component including conductive substrate with nickel la... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,802, issued on Nov. 3, was assigned to Valeo Equipements Electriques Moteur (Creteil Cedex, France). "Power module with overmoulding, device... और पढ़ें